Zoran SoCs Add Sensio Hi-Fi 3D
Sensio Technologies announced that Zoran will integrate Sensio Hi-Fi 3D decoding technology into new Zoran System-on-Chip (SoC) products for 3D-capable televisions and Set-Top Boxes (STBs).
Sensio Technologies announced that Zoran will integrate Sensio Hi-Fi 3D decoding technology into new Zoran System-on-Chip (SoC) products for 3D-capable televisions and Set-Top Boxes (STBs).
Zoran Corporation announced preliminary results for its fourth quarter ended December 31, 2010.
STMicroelectronics announced that it is sampling Set-Top Box (STB) decoder chips that support the latest security and content protection technologies, including the NDS VideoGuard Security Kernel and DVB-CSA3 descrambler system.
THX Ltd. announced that LG Electronics, Sonic Solutions, JVC U.S.A, Epson America and Onkyo Sound and Vision will integrate THX Media Director technology into their devices and content distribution systems.
CEVA, Inc. announced that its CEVA-TeakLite-III DSP core has received DTS-HD Master Audio Logo certification.
Marvell announced that it is working with the DivX division of Sonic Solutions to incorporate DivX TV support into Marvell’s media processors.
Freescale Semiconductor announced it is working with RealD Inc. to create an active 3D eyewear platform that addresses various issues associated with infrared based products.
RealD Inc. announced its new universal active 3D eyewear technology at CES 2011 in Las Vegas.
Sigma Designs announced that it has launched its latest SMP8910 and SMP8670 Secure Media Processors.
The DivX division of Sonic Solutions announced that Broadcom’s BCM7208 HD IP STB System-on-Chip (SoC) is the first DivX Plus HD Certified chip available for Set-Top Boxes (STBs).
Sensio Technologies Inc. announced SENSIO Autodetect for Audio/Video Receivers (AVRs), Set-Top-Boxes (STBs), 3D televisions (3DTVs), Blu-ray Disc (BD) players and professional video-processing equipment.