Sonic Solutions announced that Renesas Electronics Corporation will include Sonic’s RoxioNow entertainment platform in Renesas’ upcoming system-on-chips (SoCs), which will be used in next-generation connected HDTVs and Blu-ray Disc (BD) players.
Technicolor announced that it is working with Intel on its latest Atom CE4200 processor with the intent to develop a new generation of integrated broadcast and IP set-top boxes.
Sonic Solutions announced that MStar Semiconductor, Inc. will include Sonic’s RoxioNow entertainment platform in MStar’s SoC solutions, which will be used in upcoming connected HDTVs.
DisplayLink Corp. announced its new SuperSpeed USB (USB 3.0) chip platform for displays, docking stations and other integrated devices to be showcased next week at the Intel Developer Forum in San Francisco, California.
Sigma Designs and TDVision Systems announced that Sigma will support TDVision System’s Full HD stereoscopic video decoding technology.
Zoran Corporation announced that it is demonstrating its latest cable and satellite set-top box processor platforms at the International Broadcasting Convention (IBC) from Sept 10 to 14, 2010 in Amsterdam.
SanDisk Corporation announced that NDS Group has successfully combined NDS’ MediaHighway STB software with SanDisk’s P4 solid state drives (SSD) to enable a new range of lower cost set-top boxes (STB) with DVR-like functions.
STMicroelectronics announced a new TV System-on-Chip (SoC) incorporating an integrated 3D graphics accelerator, enabling next-generation Internet TV services, user interfaces and casual gaming.
DivX, Inc. announced that Broadcom Corporation’s BCM3549 connected digital television (DTV) system-on-a-chip (SoC) solution is the company’s first platform to complete DivX Plus HD Certification.
Zoran Corporation announced that it is demonstrating its latest 3D, Internet Connected DTV and Blu-ray Disc (BD) platforms for global consumer electronics manufacturers at IFA 2010 in Berlin from Sept. 3 to 8, 2010.
Trident Microsystems, Inc. announced that it will demonstrate its integrated 2D-to-3D conversion chipset at the IFA show this week in Berlin, Germany.