NEC Electronics America, Inc. announced that it will highlight the latest generation of Universal Serial Bus (USB) technologies at the International Consumer Electronics Show (CES) January 7-10 in Las Vegas. According to the statement, a working demonstration of the company’s USB 3.0, or SuperSpeed, capabilities will be showcased in the USB TechZone, located in the …
Broadcom Corporation announced that it is the first semiconductor provider to ship a true single die Blu-ray Disc chip. According to the statement, Broadcom’s new BCM7630 combines optical front-end and back-end video decoding and display technologies in a single die offering, as well as supports Internet streaming applications such as Netflix 2.0, Pandora Internet Radio, …
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