Texas Instruments Unveils New DLP Chipset
Texas Instruments DLP announced a new family of image processing chips designed for front projectors.
Archive of posts filed under the Components and Materials category.
Panasonic Improves Blu-ray Laser Design
Panasonic announced that it has developed a simplified three-wavelength semiconductor laser for Blu-ray Disc (BD) drives and players.
Sigma Designs Launches Media Player SoC
Sigma Designs announced its new SMP8674 media processor, which is intended for hybrid IPTV Set-Top Boxes (STBs), OTT streaming players and WiDi and Wi-Fi display receivers.
Sharp Develops Mobile Display Technology
Sharp and Semiconductor Energy Laboratory announced that the companies have jointly developed a new oxide semiconductor (IGZO) display technology for mobile device displays.
Intel Rolls Out Third Generation Core Processors
Intel Corporation announced its new 3rd generation Core microprocessor family, which employs company’s 22nm 3-D tri-Gate transistor technology.
Tensilica HiFi Audio DSPs Support DRA
Tensilica announced that it has added support for the Dynamic Resolution Adaptation (DRA) standard to its HiFi Audio digital signal processors (DSPs).
Sigmac Sources TV Panels from LG Electronics
Southern Products (Sigmac USA) announced that it has signed an agreement to integrate LCD and LED flat panels from LG Electronics into Sigmac televisions.
Apple iPad Costs $375 to Produce
IHS iSuppli announced that, according to its latest teardown analysis, Apple’s iPad (32GB + 4G) tablet costs the company $375.10 in materials and labour to produce.
Renesas Launches SoC for Hybrid Set-Top Boxes
Renesas Electronics announced its new R-Home S1 System-on-Chip (SoC), which is designed for hybrid Set-Top Boxes (STBs).
AU Optronics Convicted in LCD Price Fixing Scheme
The U.S. Department of Justice (DOJ) announced that a federal jury in San Francisco found AU Optronics guilty of participating in a conspiracy to fix the prices of Thin-film Transistor (TFT) Liquid Crystal Display (LCD) panels.
VIA Goes With Tensilica for SSD Chip Design
Tensilica announced that VIA Technologies has selected Tensilica’s Xtensa dataplane processors (DPUs) for a system-on-chip (SOC) design for solid state drives (SSDs).