Flash Memory Summit 2011 Ready to Launch
Conference ConCepts announced that the sixth annual Flash Memory Summit will be held August 9-11, 2011 at the Santa Clara Convention Center.
Archive of posts tagged NAND
SanDisk Acquires Pliant Technology
SanDisk Corporation announced that it will acquire Pliant Technology, a developer of enterprise Solid-State Drives (SSD).
Samsung Sells HDD Business to Seagate
Seagate Technology and Samsung Electronics announced that Samsung will sell its hard disk drive (HDD) business to Seagate for roughly $1.375 billion in cash and stock.
Intel and Micron Shrink Flash Memory
Intel Corporation and Micron Technology announced a new 20-nanometer (nm) process technology for manufacturing NAND flash memory.
Potential Supply Problems for iPad 2
IHS iSuppli announced that its latest research suggests the earthquake in Japan may disrupt the supply of components necessary to produce Apple’s iPad 2.
Japan Quake Impacts Electronic Components Supply and Pricing
IHS iSuppli offered further commentary on the possible impact the earthquake in Japan may have on the price and supply of NAND flash memory, DRAM, microcontrollers, standard logic, LCD panels and LCD parts and materials.
Apple iPad 2 Costs $327
IHS iSuppli announced that, according to its latest teardown analysis, Apple’s iPad 2 (32GB GSM/HSPA) tablet carries a bill of materials (BOM) of $326.60.
Japan Quake Impacts Electronics Sector
IHS iSuppli offered its commentary on the possible impact the earthquake in Japan will have on the electronics sector.
Motorola XOOM Tablet Costs $360
IHS iSuppli announced that, according to its latest teardown analysis, Motorola’s XOOM tablet carries a bill of materials (BOM) of $359.92, compared to approximately $320 for a 32GB 3G iPad.
Intel Launches 510 Series Solid-State Drives
Intel announced that it is now shipping its new 510 series of Solid-State Drives (SSD).
JEDEC Focuses on Hybrid Memory Modules
JEDEC Solid State Technology Association announced that its JC-45 Committee for DRAM Modules intends to form a new subcommittee focused on the standardization of hybrid memory modules.