Sensio Technologies Inc. announced that a major semiconductor manufacturer plans to incorporate the SENSIO 3D format into upcoming system-on-a-chip (SoC) and digital signal processing (DSP) products targeted at 3D TVs.
Sigma Designs announced that it will demonstrate its media processing, home entertainment networking, 3D display and home control components at CEATEC 2010.
Marvell announced that it has introduced its ARMADA 628 1.5 GHz tri-core application processor, which supports dual stream 1080p 3D video for smartphones, tablets and other mobile consumer devices.
Sonic Solutions announced that Renesas Electronics Corporation will include Sonic’s RoxioNow entertainment platform in Renesas’ upcoming system-on-chips (SoCs), which will be used in next-generation connected HDTVs and Blu-ray Disc (BD) players.
Sonic Solutions announced that MStar Semiconductor, Inc. will include Sonic’s RoxioNow entertainment platform in MStar’s SoC solutions, which will be used in upcoming connected HDTVs.
Sigma Designs and TDVision Systems announced that Sigma will support TDVision System’s Full HD stereoscopic video decoding technology.
STMicroelectronics announced a new TV System-on-Chip (SoC) incorporating an integrated 3D graphics accelerator, enabling next-generation Internet TV services, user interfaces and casual gaming.
DivX, Inc. announced that Broadcom Corporation’s BCM3549 connected digital television (DTV) system-on-a-chip (SoC) solution is the company’s first platform to complete DivX Plus HD Certification.
In-Stat announced that the value of MPEG IC revenue will grow to $4.5 billion by 2014. According to the statement, video decoding chips are becoming video decoding systems and standalone video encoding chips have given way to highly programmable system-on-chip (SoC) devices, which are now expanding to include the radio and communication components around them.
STMicroelectronics announced a new TV System-on-Chip (SoC) IC offering 3D TV support and 120Hz MEMC (motion estimation, motion compensation). According to the statement, designed for next–generation 1080p full-high-definition (FHD) integrated Digital TVs (iDTVs), ST’s new FLI7525 SoC enables a new class of mid-range, 3D TV-enabled, 120Hz Internet TVs.
Sensio Technologies Inc. announced that Trident Microsystems Inc. will integrate Sensio 3D technology into its system-on-chip (SoC) and discrete semiconductor solutions targeted at the digital home entertainment environment.